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Mounting Technology Product List and Ranking from 14 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Apr 08, 2026～May 05, 2026
This ranking is based on the number of page views on our site.

Mounting Technology Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Apr 08, 2026～May 05, 2026
This ranking is based on the number of page views on our site.

  1. TECHNICAL INFOMATION INSTITUTE CO.,LTD Tokyo//Service Industry
  2. コネクテックジャパン Niigata//Electronic Components and Semiconductors
  3. 三幸電機 Aichi//Industrial Electrical Equipment
  4. ケイワイ電子工業 Osaka//Industrial Electrical Equipment
  5. 5 AndTech Kanagawa//Service Industry
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Mounting Technology Product ranking

Last Updated： Aggregation Period:Apr 08, 2026～May 05, 2026
This ranking is based on the number of page views on our site.

  1. Book: Development and Implementation Technology of Printed Circuit Board Materials (2054BOD) TECHNICAL INFOMATION INSTITUTE CO.,LTD
  2. "MONSTER PAC" semiconductor packaging technology that achieves low temperature and high precision. コネクテックジャパン
  3. [EMS Implementation Technology] 0603 Size Chip Component Mounting Technology 三幸電機
  4. High-quality support. Introduction to K-Y Electronics' SMT process! [Materials available] ケイワイ電子工業
  5. 4 Materials and mounting technologies for increasing the large current capacity, heat resistance, and heat dissipation of power devices. AndTech

Mounting Technology Product List

1～22 item / All 22 items

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High-quality support. Introduction to K-Y Electronics' SMT process! [Materials available]

High-quality support. Introduction to K-Y Electronics' SMT process! [Materials available]

Introducing the SMT process that achieves high-quality circuit board assembly! We are currently offering comprehensive materials to assist you in considering the SMT process!

We handle everything from circuit board assembly to unit assembly, and we are distributing the "Comprehensive Materials on SMT 2018 Edition" from K-Y Electronics, which specializes in fine mechanical assembly. The publication includes a wealth of basic knowledge such as the sizes of circuit boards and components that can be produced with our equipment, specifications regarding assembly programs and land design, and important points to consider during circuit board design. This book will be useful for those considering SMT. 【Contents (partial)】 ■ Overview of our equipment ■ Usable circuit board sizes and component sizes ■ Specifications for creating assembly programs ■ Important points regarding circuit board design ■ Specifications for land design *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit Board Inspection Equipment
  • Circuit board design and manufacturing
  • Solder
  • Mounting Technology

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Book: Development and Implementation Technology of Printed Circuit Board Materials (2054BOD)

Book: Development and Implementation Technology of Printed Circuit Board Materials (2054BOD)

Technical Specialized Books - Focusing on Automotive and 5G Applications

Unraveling substrate, wiring, mounting materials, and mounting technology aimed at "miniaturization and high density," "high speed and high frequency," and "flexibility." ■ Key points of this book ◎ Response to automotive and miniaturization for high density ◎ Response to 5G and high-speed communication ◎ Advancement of mounting and design technology

  • IPROS3391385136135994447_220x220.png
  • others
  • Technical and Reference Books
  • Technical and Reference Books
  • Mounting Technology

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Regarding the component land method in circuit board design and assembly.

Regarding the component land method in circuit board design and assembly.

A method that directly contacts the pins to the legs and electrodes of the measuring components!

This document provides information on the component land method. It introduces a method of making contact at numbered positions using diagrams and conducting individual measurements. Detailed diagrams are included, making it a useful reference. We encourage you to read it. [Contents (excerpt)] ■ Board mounting, quality, technology ■ About the component land method *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Mounting Technology

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"Achieving the world's smallest level 25um crimp diameter bump" - Compact and high-density mounting technology

"Achieving the world's smallest level 25um crimp diameter bump" - Compact and high-density mounting technology

Challenging the limits of ultra-small diameter bumps! Achieving the world's smallest level 25um crimp diameter bump with compact, high-density mounting technology!

Hakodate Electronics Co., Ltd. is engaged in the development of fine-pitch gold stud bump processing technology and the development of mounting structures utilizing gold stud bumps through prototype development. By advancing the technology for miniaturization and fine-pitching of Au stud bumps, we achieve the world's smallest level of 25μm bonding diameter bumps. 【Bump Diameter Comparison】 ■ Bump Bonding Diameter (Bump Pitch) - 88μm (90μm) - 61μm (70μm) - 51μm (60μm) - 40μm (50μm) - 25μm (28μm) *For more details, please feel free to contact us.

  • Other mounting machines
  • Mounting Technology

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High-density packaging technology "FCB & COF"

High-density packaging technology "FCB & COF"

It is possible to further reduce the implementation area compared to the WB method, enabling miniaturization on printed circuit boards.

"FCB&COF (Flip Chip Bonding) & COF (Chip on FPC)" is a method that forms bumps on the electrode part of a semiconductor chip and connects it by placing it directly on the electrodes of a printed circuit board (face down) while applying heat. It is also possible to implement it in combination with SMT, enabling miniaturization of the module. 【Features】 ■ Miniaturization on printed circuit boards is possible ■ Implementation in combination with SMT is also possible ■ Miniaturization of the module is possible *For more details, please download the PDF or feel free to contact us.

  • Processing Contract
  • Printed Circuit Board
  • Contract manufacturing
  • Mounting Technology

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Kanda Industrial Co., Ltd. SMT Business

Kanda Industrial Co., Ltd. SMT Business

We offer our manufacturing and processing facilities to fabless companies! Let us introduce our SMT business.

At Kanda Industrial Co., Ltd.'s "SMT Division," we respond to various types of mounting, including high density, high precision (±50μm), fine, and large components with advanced technology. We accommodate not only standard sizes like 1005 and 0603 but also small chip components such as 0402, as well as irregular components like BGA (Ball Grid Array), CSP (Chip Size Package), and flip chips. Additionally, as a one-stop production facility for component mounting, we are equipped to handle everything from prototypes and small batch production to mass production, tailored to meet your needs. Please feel free to contact us when you need assistance. 【Features】 ■ Equipped to handle everything from prototypes and small batch production to mass production ■ Responding to various types of mounting, including high density, high precision (±50μm), fine, and large components with advanced technology ■ Providing manufacturing and processing facilities for fabless companies *For more details, please refer to the related link page or feel free to contact us.

  • Contract manufacturing
  • Processing Contract
  • Other electronic parts
  • Mounting Technology

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High-reliability mounting technology for electrical equipment

High-reliability mounting technology for electrical equipment

Solving your challenges! We provide implementation technology compatible with electronics.

At Oki Electric Industry, we provide mounting technologies that respond to the accelerating trend of electronics. We ensure high reliability with high-strength solder materials that meet our unique reliability evaluation standards. We solve our customers' challenges. 【Case Study】 ■Challenge - The adoption of electronic devices in harsh environments, such as around ECUs and engines, is progressing, making high reliability a pressing need. ■Solution - High reliability is ensured with high-strength solder materials that meet our unique reliability evaluation standards. - High reliability is guaranteed through 100% inspection of all pins using high-speed 3D X-ray inspection technology. *For more details, please refer to the PDF document or feel free to contact us.

  • Other mounting machines
  • Mounting Technology

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Introduction to Implementation Technology for Functional Films

Introduction to Implementation Technology for Functional Films

Contributes to the miniaturization, thinning, and lightweighting of products.

JOHNAN DMS Corporation is advancing the development of implementation technology for functional films aimed at miniaturizing and thinning products in industries such as automotive (in-vehicle), medical and healthcare devices, and infrastructure. The implementation technology for functional films contributes to solving challenges in product mechanism design. For more details, please refer to the related links.

  • Circuit board design and manufacturing
  • Mounting Technology

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To miniaturize and slim down products! Functional film implementation technology.

To miniaturize and slim down products! Functional film implementation technology.

We provide implementation services for hot melt molding, wearable devices, and stretchable films.

JOHNAN DMS Corporation is currently developing a new technology called "implementation technology for functional films" to expand the possibilities of miniaturization and thinness of products, which are in demand across various industry sectors. This technology enables implementation onto films with elasticity, allowing for adaptation to various shapes such as curves. Using this technology, we provide implementation services for "hot melt molding," "wearable devices," and "stretchable films." You can find detailed information about each service on our company website.

  • Other mounting machines
  • Mounting Technology

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COB high-density implementation problem solving

COB high-density implementation problem solving

Leave the implementation challenges to us! We will propose solutions with our unique design and know-how.

We propose unique design and implementation know-how using the technology accumulated through various achievements, covering package structure, bonding methods, and material selection. With our technical expertise and know-how in bonding methods for semiconductor bare chips, measurement, inspection, and reliability evaluation, we support our customers in solving their challenges. 【Challenges → Solutions】 ■ Want to implement without voids → Design and create dedicated FC fixtures ■ Want to use FC but can only obtain chips individually → Form bumps on individual pieces using a bump bonder ■ Implementing at an overseas factory but yield is not improving → Reassess conditions within our company. Reproduce NG and point out areas for review. *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Other mounting machines
  • Mounting Technology

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[Data] High-Density Mounting Specifications

[Data] High-Density Mounting Specifications

Introduction to wire bonding, bump bonding, and flip chip bonding!

This document includes information on "High-Density Packaging Specifications." It provides a list of materials, wire diameters, pad sizes, pitches, and other details related to the wire bonding process in wire assembly. Additionally, information on bump assembly and flip chip assembly is also presented in table format. Please feel free to consult us about any content not listed in the provided sizes. [Contents Included] ■ Wire Assembly ■ Bump Assembly ■ Flip Chip Assembly *For more details, please download the PDF or feel free to contact us.

  • Other contract services
  • Mounting Technology

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"MONSTER PAC" semiconductor packaging technology that achieves low temperature and high precision.

"MONSTER PAC" semiconductor packaging technology that achieves low temperature and high precision.

Low-temperature bonding from 80℃ unlocks the potential of heat-sensitive devices.

We have achieved high-precision mounting on thermally fragile chips and film substrates, which was impossible with conventional solder mounting. Standard solder joints require high temperatures of 260°C, but MONSTER PAC enables low-temperature bonding at 80°C to 170°C using conductive paste. This suppresses thermal expansion of materials and allows for narrow pitches of less than 40μm and high-precision mounting of less than 3μm. It is a suitable method for mounting advanced devices sensitive to heat, such as magnetic sensors and MEMS. *You can download the technical details and specifications of MONSTER PAC from here.*

  • 低温・高精度を実現する革新的半導体実装技術「MONSTER PAC」2.jpg
  • Contract manufacturing
  • Mounting Technology

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COB implementation technology

COB implementation technology

We respond to a variety of needs, focusing on the implementation of electronic components, including those equipped with bare chips.

Our company's "COB implementation technology" focuses on the mass production line for the mounting and assembly of electronic components, primarily using bare chips. "COB" refers to a high-density circuit board that directly mounts IC chips onto substrates, enabling the miniaturization and thinness of devices. We offer a comprehensive range of services from component procurement to substrate mounting, finished product assembly, and inspection, utilizing a wide array of implementation technologies such as wire bonding, die bonding, thick film printing, and lead-free/eutectic soldering. 【COB Manufacturing Line】 1) Wafer dicing 2) Die bonding 3) Wire bonding 4) Automatic mounting of SMD components 5) Electrical characteristic testing *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • ASIC
  • Dedicated IC
  • Mounting Technology

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【Technical Introduction】COB Process

【Technical Introduction】COB Process

Miniaturization of modules is possible! Semiconductor chips can be directly mounted on printed circuit boards using die bonding material!

We would like to introduce the COB process technology of Niigata Seimitsu Co., Ltd. The COB process can accommodate implementations such as a pad pitch of 0.07mm and a die size of □0.5mm. Additionally, we can comprehensively handle other processes related to the COB process, such as substrate cleaning, dicing, and pickup, all in-house. 【Features】 ■ Directly mounting semiconductor chips (ICs) onto printed circuit boards (PCBs) using die bonding material ■ A method of connecting the electrodes on the IC side to the electrodes on the PCB side using gold wire ■ Smaller mounting area compared to SMT methods, enabling miniaturization on the PCB ■ Implementation combined with SMT is also possible ■ Miniaturization of modules is achievable *For more details, please refer to the PDF document or feel free to contact us.

  • Contract manufacturing
  • Circuit board processing machine
  • Circuit board design and manufacturing
  • Mounting Technology

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[EMS Implementation Technology] 0603 Size Chip Component Mounting Technology

[EMS Implementation Technology] 0603 Size Chip Component Mounting Technology

Stable board mounting is possible even with small electronic components of size 0603! It can maintain the same soldering quality as before, even with high-density mounting.

**Features** - Miniaturization and space-saving of the substrate size By reducing the substrate size, product placement can be considered. - Maintaining soldering assembly quality through image inspection and continuity testing Our image inspection equipment and flying circuit checker enable quality confirmation inspections for assembly. - Usable even with mixed substrates of large power electronic components It is possible to mount 0603 size chips even on artwork substrates mixed with large discrete components. - Leave the design of 0603 size substrate artwork to us If you entrust us with the artwork design for 0603 size chip assembly substrates, we will design it to match our assembly equipment, ensuring better assembly quality. *For implementation evaluation data and verification details for 0603 size chips, please contact us below.*

  • EMS
  • Contract manufacturing
  • Circuit board design and manufacturing
  • Mounting Technology

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Contributing to miniaturization with high-density packaging.

Contributing to miniaturization with high-density packaging.

We achieve narrow GAP implementation and miniaturization of high-quality implementation boards.

We support the implementation of small chip components that are essential for miniaturizing substrates, as well as their narrow gap mounting. Our company has contributed to the miniaturization of Sony products by pursuing high-density mounting technology. We provide high-quality support for high-density mounting, such as the implementation of 0402 size components used in mobile devices like smartphones. Additionally, we can also accommodate even smaller 0201 and 03015 size component implementations. 【Features】 ■ Implementation of 0402 size components with narrow gaps ■ Capable of mixed mounting with large components (such as connectors) ■ Also supports the implementation of 0201 and 03015 size components ■ Equipped with solder printing inspection machines, pre-reflow inspection machines, and post-reflow inspection machines to ensure high quality *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Mounting Technology

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Design, structure, assembly technology of LED packages, and implementation technology onto substrates.

Design, structure, assembly technology of LED packages, and implementation technology onto substrates.

★New manufacturing methods (tandemization of multiple wavelengths, MCM, organic LEDs) ★Topics on phosphors (such as sialon phosphors) and key points of phosphor coating technology.

Speaker Mr. Gen Murakami, Ph.D. in Engineering, Representative Director of Genten Co., Ltd. Target Audience: Engineers, researchers, and relevant departments facing challenges with LED packages Venue: Tekno Kawasaki, 5th Floor, Room 5 [Kanagawa, Kawasaki] 10-minute walk from JR Nambu Line "Musashi-Mizonokuchi" Station Date and Time: March 29, 2011 (Tuesday) 12:30-16:30 Capacity: 30 people *Registration will close once full. Please apply early.

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar
  • Mounting Technology

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Notice of Participation in Japan Manufacturing World

Notice of Participation in Japan Manufacturing World

We will exhibit at the 34th Design and Manufacturing Solutions Expo. We will showcase our technologies related to manufacturing that we have developed at Sony.

We will introduce our technology that addresses your concerns related to product design, manufacturing, and other aspects of manufacturing, as well as help realize your ideas of "I want to try this." If you have time, please visit our booth. 【Exhibition Information】 - Exhibition Name: Japan Manufacturing World 34th Design & Manufacturing Solutions Expo - Dates: June 22, 2022 (Wednesday) to June 24, 2022 (Friday) - Opening Hours: 10:00 AM to 6:00 PM (Ends at 5:00 PM only on June 24) - Venue: Tokyo Big Sight - Booth Number: 14-31 - Official Website: https://www.japan-mfg.jp/ja-jp.html 【Main Exhibition Contents】 - Element technologies to realize "I want to create this product" - Design capabilities that give you a "step" ahead of competitors - Implementation technologies that support the miniaturization and weight reduction of Sony products - Sony-quality manufacturing that can also accommodate medical devices - Custom power supplies/chargers tailored to a wide variety of needs You can check the list of manufacturing services available for download in PDF format.

  • Other contract services
  • Contract manufacturing
  • Mounting Technology

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Design, structure, assembly technology of LED packages, and implementation technology onto substrates.

Design, structure, assembly technology of LED packages, and implementation technology onto substrates.

★Trend of Transparent Resin: Resin with Fluorescent Materials! Low Stress Resinization! High Refractive Index!

**Lecture Summary** Semiconductor packaging technology is an important technology that enhances the functionality of electronic devices, alongside semiconductor miniaturization technology and logic design technology. It continues to lead the world in semiconductor packaging materials and assembly equipment. In recent years, the technology has evolved from SiP (System in Package) using multi-layer stacking of elements to MiP (Multi functions in a Package), which integrates not only electronic conduction but also wireless (RF) and optical (photon) functions within a single package. As LED assembly technology becomes a crucial technology for the MiP era, this presentation will provide an overview of the current LED assembly technology and discuss future development directions and impacts on the market.

  • Technical Seminar
  • LED Module
  • LED lighting
  • Mounting Technology

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Design, structure, assembly technology of LED packages, and implementation technology on substrates.

Design, structure, assembly technology of LED packages, and implementation technology on substrates.

Trends in transparent resin: resin with phosphors! Low-stress resin! High refractive index! New manufacturing methods (multi-wavelength tandem, MCM, organic LED).

Speaker: Mr. Gen Murakami, President of Mototen Co., Ltd., Doctor of Engineering Venue: Tekno Kawasaki, 5th Floor, Room 5 Date and Time: March 29, 2011 (Tuesday) 12:30-16:30

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar
  • Mounting Technology

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Implementation and packaging technology of MEMS devices and improvement of reliability.

Implementation and packaging technology of MEMS devices and improvement of reliability.

★How to enhance reliability in terms of joint distortion and joint strength!? ★Increase reliability through semiconductor integration!

Speaker Part 1: Toshiba Corporation, Research and Development Center, Advanced BEOL Technology Development Department, Responsible Person Part 2: Misuzu Industries Co., Ltd., Responsible Person Part 3: Koga Research Institute Sensor Consultant / Part-time Lecturer at Ibaraki University / Industry-Academia-Government Collaboration Coordinator, Ph.D. Tomo Shimada Target Audience: Engineers and researchers related to MEMS devices and microfabrication processes Venue: Tokyo Chuo Ward Industrial Hall, 4th Floor, Meeting Room 1 [Tokyo, Nihonbashi] Access: 4 minutes from Exit B3 of Higashi-Nihonbashi Station on the JR Toei Asakusa Line, towards Asakusabashi/ Oshiage Date and Time: December 22, 2011 (Thursday) 11:00 AM - 4:00 PM Capacity: 30 people *Registration will close once full. Please apply early. Participation Fee: [Early Bird Discount Price] 51,450 yen (including tax and text fee) for 2 people from one company *Limited to Tech-Zone members who apply by December 8. Membership registration is free. *After December 8, the [Regular Price] will be 54,600 yen (including tax and text fee) for 2 people from one company.

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar
  • Mounting Technology

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Materials and mounting technologies for increasing the large current capacity, heat resistance, and heat dissipation of power devices.

Materials and mounting technologies for increasing the large current capacity, heat resistance, and heat dissipation of power devices.

The heat dissipation and heat resistance of components required due to the increase in large currents!

- Sealing, Bonding, Mounting Technology, Reliability Evaluation - High-Power Devices: the Advanced Materials and the Mounting Technology ★ The heat dissipation and heat resistance required for components due to increased current! ★ The demand for inverters is rising with the energy-saving of devices and the spread of EVs and HEVs. What are the future technological trends of power devices, which are the core technology!? 【Venue】 Kawasaki City International Exchange Center, Conference Room 1【Kanagawa, Kawasaki】 12 minutes on foot from Motosumiyoshi Station on the Tokyu Toyoko Line Date and Time June 27, 2013 (Thursday) 10:15-16:30

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar
  • Mounting Technology

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